文章主题:【Intel 上海实习】Electronic Package Engineering Internship
| zfhr | 1 楼 |
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发信人: zfhr, 信区: 招聘求职 标 题: Re: 【Intel 上海实习】Electronic Package Engineering Internship 发信站: 斗转星云 BBS站 (2021/3/1 16:34:56) 【Intel 上海实习】Electronic Package Engineering Internship Location: Shanghai Contact: bin.liu@intel.com Job Description ?The Non-Volatile Memory group in Shanghai PRC is looking for a full-time paid intern to help support Package path finding development team projects, including Silicon / package interaction assembly process solutions, DOEs executions and coordination with Fab, Intel assembly subcontractors to fulfill assembly process development project objectives, ensure project schedules and on-time qualification to achieve new product and package transfer to high volume manufacturing. Additional project responsibilities will be added once project begins. Qualifications Minimum Qualifications: The candidate must be pursuing a BS degree in Materials Science, Metallurgical Engineering, Ceramic Engineering, Chemical Engineering, Mechanical Engineering or related field. The candidate must have the unrestricted right to work in the U.S. without requiring sponsorship. Preferred Qualifications: experience/knowledge in electronic materials processing. experience/knowledge experience in IC fabrication process. experience/knowledge in electronic packaging materials and/or assembly process. experience/knowledge in material sample polish and grind. experience/knowledge in fast paced environment. Pls send your resume to bin.liu@intel.com 即刻微信搜索“英特尔招聘在线”公众号，关注我们，收获更多精彩 |
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